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SM662PEC-BD 商品描述
商品名称 SM662PEC-BD
厂家品牌
商品资料 Datasheet
商品分类 存储器
商品描述 FERRI-EMMC BGA 153-B EMMC 3D TLC
现货库存 待更新
SM662PEC-BD 规格参数
存储器类型: SELECT COLUMN_NAME as bt,column_comment as nr FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_ccq' AND table_schema='golon' and column_comment like '*%' -
存储器格式: SELECT COLUMN_NAME as bt,column_comment as nr FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_ccq' AND table_schema='golon' and column_comment like '*%' -
存储容量: SELECT COLUMN_NAME as bt,column_comment as nr FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_ccq' AND table_schema='golon' and column_comment like '*%' -
存储器接口: SELECT COLUMN_NAME as bt,column_comment as nr FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_ccq' AND table_schema='golon' and column_comment like '*%' -
电压-电源: SELECT COLUMN_NAME as bt,column_comment as nr FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_ccq' AND table_schema='golon' and column_comment like '*%' -
工作温度: SELECT COLUMN_NAME as bt,column_comment as nr FROM INFORMATION_SCHEMA.Columns WHERE table_name='golon_ccq' AND table_schema='golon' and column_comment like '*%' -

电路板一站式服务！
元器件采购
1.按完整BOM完成元器件采购
2. BOM清单的元器件型号要求完整
3. 采购的元器件严格把控质量,质量第一
4. 特殊元器件或特供元器件可有客户提供
PCB板生产
1. 1-20层电路板制造能力,HID/FPC及软硬结合板
2. 夹具试验和飞针试验
3. 快速报价,在线报价,电子邮件报价
4. 2015年入股PCB工厂,质量好,交货期快
电路板贴片
1.元器件物料代购及物料检查
2. SMD贴片上机前物料再次核对
3. 贴片及后焊完成后第一样品检查测试
4. 2年质保期
电路板测试
1. SMD贴片后自动话设备自检测+人工目测
2. AOI 测试(BGA封装的X光射线测试)
3. 根据产品特性定制测试夹具测试
4. 特定产品的按要求流程测试(自由测试)
成品的组装
1.承接外壳设计和开模业务
2. 五金模具/CNC和塑胶模具
3. 两条成品组装生产线
4. 完成最终的整个成品测试
联系我们 0755-28435922

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